例句與用法

1. According to the m1l - std - 883c standard of thermal cycle loading , the delamination propagation rates at the interface between chip and underfill were studied experimentally by using c - mode scanning acoustic microscope ( c - sam ) for two types of flip chip packages with different states of solder joint
   采用mil - std - 883c標準，通過溫度循環實驗，使用高頻超聲顯微鏡( c - sam )無損檢測技術，測量了在不同焊點狀態下， b型和d型兩種實際倒裝焊封裝芯片與底充膠界面分層裂縫傳播速率。